Memory chip having an integrated data mover

ABSTRACT

A memory chip having a first set of pins configured to allow the memory chip to be coupled to a first microchip or device via first wiring. The memory chip also having a second set of pins configured to allow the memory chip to be coupled to a second microchip or device via second wiring that is separate from the first wiring. The memory chip also having a data mover configured to facilitate access to the second microchip or device, via the second set of pins, to read data from the second microchip or device and write data to the second microchip or device. Also, a system having the memory chip, the first microchip or device, and the second microchip or device.

FIELD OF THE TECHNOLOGY

At least some embodiments disclosed herein relate to a memory chiphaving an integrated data mover. Also, at least some embodimentsdisclosed herein relate to using such a memory chip in flexibleprovisioning of a string of memory chips to form a memory.

BACKGROUND

Memory of a computing system can be hierarchical. Often referred to asmemory hierarchy in computer architecture, memory hierarchy can separatecomputer memory into a hierarchy based on certain factors such asresponse time, complexity, capacity, persistence and memory bandwidth.Such factors can be related and can often be tradeoffs which furtheremphasizes the usefulness of a memory hierarchy.

In general, memory hierarchy affects performance in a computer system.Prioritizing memory bandwidth and speed over other factors can requireconsidering the restrictions of a memory hierarchy, such as responsetime, complexity, capacity, and persistence. To manage suchprioritization, different types of memory chips can be combined tobalance chips that are faster with chips that are more reliable or costeffective, etc. Each of the various chips can be viewed as part of amemory hierarchy. And, for example, to reduce latency on faster chips,other chips in a memory chip combination can respond by filling a bufferand then signaling for activating the transfer of data between chips.

Memory hierarchy can be made of up of chips with different types ofmemory units. For example, memory units can be dynamic random-accessmemory (DRAM) units. DRAM is a type of random access semiconductormemory that stores each bit of data in a memory cell, which usuallyincludes a capacitor and a metal-oxide-semiconductor field-effecttransistor (MOSFET). The capacitor can either be charged or dischargedwhich represents the two values of a bit, “0” and “1”. In DRAM, theelectric charge on a capacitor leaks off, so DRAM requires an externalmemory refresh circuit which periodically rewrites the data in thecapacitors by restoring the original charge per capacitor. On the otherhand, with static random-access memory (SRAM) units a refresh feature isnot needed. Also, DRAM is considered volatile memory since it loses itsdata rapidly when power is removed. This is different from flash memoryand other types of non-volatile memory, such as non-volatilerandom-access memory (NVRAM), in which data storage is more persistent.

A type of NVRAM is 3D XPoint memory. With 3D XPoint memory, memory unitsstore bits based on a change of bulk resistance in conjunction with astackable cross-gridded data access array. 3D XPoint memory can be morecost effective than DRAM but less cost effective than flash memory.

Flash memory is another type of non-volatile memory. An advantage offlash memory is that is can be electrically erased and reprogrammed.Flash memory is considered to have two main types, NAND-type flashmemory and NOR-type flash memory, which are named after the NAND and NORlogic gates that can implement the memory units of flash memory. Theflash memory units or cells exhibit internal characteristics similar tothose of the corresponding gates. A NAND-type flash memory includes NANDgates. A NOR-type flash memory includes NOR gates. NAND-type flashmemory may be written and read in blocks which can be smaller than theentire device. NOR-type flash permits a single byte to be written to anerased location or read independently. Because of advantages ofNAND-type flash memory, such memory has been often utilized for memorycards, USB flash drives, and solid-state drives. However, a primarytradeoff of using flash memory in general is that it is only capable ofa relatively small number of write cycles in a specific block comparedto other types of memory such as DRAM and NVRAM.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure will be understood more fully from the detaileddescription given below and from the accompanying drawings of variousembodiments of the disclosure.

FIG. 1 illustrates an example memory system that is configured toprovide flexible provisioning of multi-tier memory, in accordance withsome embodiments of the present disclosure.

FIG. 2 illustrates an example memory system and processor chipconfigured to provide flexible provisioning of multi-tier memory, inaccordance with some embodiments of the present disclosure.

FIG. 3 illustrates an example memory system and memory controller chipconfigured to provide flexible provisioning of multi-tier memory, inaccordance with some embodiments of the present disclosure.

FIG. 4 illustrates an example memory system configured to provideflexible provisioning of multi-tier memory with tiers that each includemultiple memory chips, in accordance with some embodiments of thepresent disclosure.

FIG. 5 illustrates example parts of an example computing device, inaccordance with some embodiments of the present disclosure.

FIG. 6 illustrates an example system that includes a memory chip havingan integrated data mover, in accordance with some embodiments of thepresent disclosure.

FIG. 7 illustrates an example system that includes the memory chip shownin FIG. 6 as well as a microchip or device that receives datatransferred from the data mover and has logical-to-physical mapping formapping the received data, in accordance with some embodiments of thepresent disclosure.

FIG. 8 illustrates an example system that includes the memory chip shownin FIG. 6 which is also shown having encryption and authenticationcircuitry, in accordance with some embodiments of the presentdisclosure.

DETAILED DESCRIPTION

At least some embodiments disclosed herein relate to a memory chiphaving an integrated data mover (e.g., see FIGS. 6-8 as well ascorresponding text herein). Also, at least some embodiments disclosedherein relate to using such a memory chip in flexible provisioning of astring of memory chips to form a memory (e.g., see FIGS. 1-8 as well ascorresponding text herein). For example, one or more instances of thememory chip depicted in FIGS. 6-8 can be used as one or more memorychips in flexible provisioning of the string of memory chips 102 shownin FIGS. 1-3 as well as the string of memory chips 402 shown in FIG. 4.

For the purposes of this disclosure, a data mover is a circuit in amemory chip or device that manages the transfer of data to anothermemory chip or device. Such a data mover can be used in a group ofmemory chips or devices in a memory hierarchy. Thus, a data mover canfacilitate movement of data from one memory chip or device to anothermemory chip or device in a memory hierarchy.

The memory chip (e.g., see memory chip 602) that includes the integrateddata mover (e.g., see data mover 608) can have two separate sets of pins(e.g., see sets of pins 604 and 606 shown in FIGS. 6-8) for respectiveseparate connections to a first microchip or device (e.g., see firstmicrochip or device 624 shown in FIGS. 6-8) and a second microchip ordevice (e.g., see second microchip or device 626 shown in FIGS. 6-8).The first microchip or device can be a processor, such as a system on achip (SoC), or another memory chip. The second microchip or device canbe another memory chip or a memory device such as a mass storage device.

In some embodiments, the memory chip can include an encryption engine(e.g., see encryption engine 802 shown in FIG. 8) in addition to thedata mover to secure data to be moved to the second microchip or device.Also, in such embodiments and others, the memory chip can include agatekeeper device (e.g., see gatekeeper 804 shown in FIG. 8) that canperform authentication for access of data stored in the second microchipor device.

The data mover can combine data stored in the memory chip (e.g., seeportion of memory 610 having data accessible by the first microchip ordevice 624 as shown in FIGS. 6-8) on its way to the second microchip ordevice using various strategies. This can improve write performance andendurance of the second microchip or device.

In general, the memory chip can include a first set of pins, a secondset of pins, and an integrated data mover. The first set of pins can beconfigured to allow the memory chip to be coupled to a first microchipor device via first wiring. The second set of pins can be configured toallow the memory chip to be coupled to a second microchip or device viasecond wiring that is separate from the first wiring. The data mover canbe configured to facilitate access to the second microchip or device,via the second set of pins, to read data from the second microchip ordevice and write data to the second microchip or device.

The memory chip can be a non-volatile random-access memory (NVRAM) chipin that the memory chip includes a plurality of NVRAM cells. And, insome embodiments, the plurality of NVRAM cells can include a pluralityof 3D XPoint memory cells. Also, the memory chip can be a dynamicrandom-access memory (DRAM) chip in that the memory chip includes aplurality of DRAM cells. Also, the memory chip can be a flash memorychip in that the memory chip includes a plurality of flash memory cells.The plurality of flash memory cells can include a plurality of NAND-typeflash memory cells.

The first microchip or device can be another memory chip or a memorydevice or a processor chip or a processor device. In some embodiments,for example, the first microchip or device is a SoC. In someembodiments, for example, the first microchip or device is a DRAM chip.In some embodiments, for example, the first microchip or device is aNVRAM chip. Data stored in a portion of the memory chip can beaccessible by or through the first microchip or device via the first setof pins. Also, when the data stored in the portion of the memory chip isaccessible through the first microchip or device it is being accessed byanother memory chip or device or a processor chip or device. And, thefirst microchip or device can read data from the memory chip as well aswrite data to the memory chip.

The second microchip or device can be another memory chip or a memorydevice. In some embodiments, for example, the second microchip or deviceis a DRAM chip. In some embodiments, for example, the second microchipor device is a NVRAM chip. In some embodiments, for example, the secondmicrochip or device is a flash memory chip (e.g., a NAND-type flashmemory chip). Data stored in a portion of the second microchip or devicecan be accessible by or through the memory chip via the second set ofpins. Also, when the data stored in the portion of the second microchipor device is accessible through the memory chip it is being accessed byanother memory chip or device or a processor chip or device (such as thefirst microchip or device). And, the memory chip can read data from thesecond microchip or device as well as write data to the second microchipor device.

The data mover can be configured to combine the data stored in a portionof the memory chip by moving the data in blocks to the second microchipor device. For example, the data mover can be configured to combine thedata stored in the portion of the memory chip that is accessible by orthrough the first microchip or device via the first set of pins bymoving the data in blocks to the second microchip or device. The datamover by moving data in blocks can increase write performance andendurance of the second microchip or device, and sequential or blockaccess on memory chips is orders of magnitude faster than random accesson memory chips.

In some embodiments, the blocks are at a granularity that is coarserthan the data initially stored in a portion of the memory chip. Forexample, the blocks are at a granularity that is coarser than the datainitially stored in the portion of the memory chip that is accessible byor through the first microchip or device via the first set of pins. Theblocks being at a granularity that is coarser than the pre-blocked datain the memory chip, such as the data to be accessed by first microchipor device, can reduce the frequency of data writes to the secondmicrochip or device.

The data mover can also be configured to buffer movement of changes tothe data stored in a portion of the memory chip, such as data stored inthe portion of the memory chip that is accessible to the first microchipor device. And, in such embodiments, the data mover can also beconfigured to send write requests to the second microchip or device in asuitable size due to the buffering by the data mover. When the secondmicrochip or device is a second microchip or device and a write to thesecond microchip or device is in the suitable size due to the bufferingby the data mover, the second microchip or device can erase a block andprogram the block in the second microchip or device according to thewrite without further processing or minimal processing in the secondmicrochip or device. This is one example way that the data moverintegrated in the memory chip can improve write performance andendurance of the second microchip or device. Also, with the buffering bythe data mover and when frequent and/or random changes are made to thedata in a portion of the memory chip (such as the data in the portion ofthe chip accessible by the first microchip or device), the secondmicrochip or device does not have to be frequently erased andreprogrammed in a corresponding way as the changes occurring in theportion of the memory chip.

The buffering by the data mover is even more beneficial when the secondmicrochip or device is a flash memory chip because the buffering canremove or at least limit the effects of write amplification that occursin flash memory. Write amplification can be reduced or even eliminatedby the buffering because, with the buffering, a write request sent bythe memory chip can be modified to a suitable size or granularityexpected by the receiving flash memory chip. Thus, the flash memory chipcan erase a block and program the block according to the write requestwithout possible duplication of the write and thus avoid furtherprocessing in the second microchip or device.

The data mover can also be configured to bundle changed addresses in thechanges to the data stored in a portion of the memory chip (such as thedata in the portion of the memory chip accessible to the first microchipor device). In such embodiments, the data mover can also be configuredto write bundled changed addresses into another portion of the memorychip to be moved to the second microchip or device via a write requestto the second microchip or device. These features of the data mover canimprove the buffering by the data mover and the sending of writerequests according to the buffering since the bundling of changedaddresses can be controlled by the data mover to correspond to asuitable size or granularity expected by the receiving second microchipor device.

In some embodiments, the memory chip can also includelogical-to-physical mapping for the second microchip or device (e.g.,see logical-to-physical mapping 612 shown in FIG. 6). And, thelogical-to-physical mapping for the second microchip or device can beconfigured to use the bundled changed addresses as input. In some otherembodiments, the second microchip or device can includelogical-to-physical mapping for itself (e.g., see logical-to-physicalmapping 712 shown in FIG. 7) that is configured to use the bundledchanged addresses as input once the bundled changed addresses are sentin a write request to the second microchip or device.

Some embodiments described herein can include a system that includes anintermediate memory chip (e.g., see memory chip 602), a first memorychip (e.g., see first microchip or device 624), and a second memory chip(e.g., see second microchip or device 626). In such embodiments, theintermediate memory chip can be a NVRAM chip (e.g., a 3D XPoint memorychip), the second memory chip can be a flash memory chip (e.g., aNAND-type flash memory chip), and the first memory chip can be a DRAMchip. Some other embodiments described herein can include a system thatincludes an intermediate memory chip (e.g., see memory chip 602), asecond memory chip (e.g., see second microchip or device 626), and aprocessor chip, such as a SoC (e.g., see first microchip or device 624).In such embodiments, the intermediate memory chip can be a NVRAM chip(e.g., a 3D XPoint memory chip) or a DRAM chip and the second memorychip can be a flash memory chip (e.g., a NAND-type flash memory chip) ora NVRAM chip.

Also, at least some aspects of the present disclosure are directed toflexible provisioning of a string of memory chips to form a memory for aprocessor chip or system on a chip (SoC), e.g., see FIGS. 1-5 as well ascorresponding text herein. From the perspective of the processor chip orSoC wired to the memory, the string of memory chips of the memoryappears no different from a single memory chip implementation; however,with the flexible provisioning, benefits of using a string of memorychips is achieved. For example, with the flexible provisioning, benefitsof using a string of memory chips with a memory hierarchy can beachieved.

The processor chip or SoC can be directly wired to a first memory chipin the string and can interact with the first memory chip withoutperceiving the memory chips in the string downstream of the first memorychip. In the memory, the first memory chip can be directly wired to asecond memory chip and can interact with the second memory chip suchthat the processor chip or SoC gains the benefits of the string of thefirst and second memory chips without perceiving the second memory chip.And, the second memory chip can be directly wired to a third memory chipand so forth such that the processor chip or SoC gains benefits of thestring of multiple memory chips without perceiving and interacting withthe multiple memory chips downstream of the first memory chip. Also, insome embodiments, each chip in the string perceives and interacts withthe immediate upstream chip and downstream chip in the string withoutperceiving chips in the string further upstream or downstream.

In some embodiments, the first memory chip in the string can be a DRAMchip. The second memory chip in the string immediately downstream of thefirst chip can be a NVRAM chip (e.g., a 3D XPoint memory chip). Thethird memory chip in the string immediately downstream of the secondchip can be a flash memory chip (e.g., a NAND-type flash memory chip).Also, for example, the string can be DRAM to DRAM to NVRAM, or DRAM toNVRAM to NVRAM, or DRAM to flash memory to flash memory; although, DRAMto NVRAM to flash memory may provide a more effective solution for astring of memory chips being flexibly provisioned as multi-tier memory.Also, for the sake of understanding the flexible provisioning of astring of memory chips disclosed herein, examples will often refer to athree-chip string of memory chips; however, it is to be understood thatthe string of memory chips can include more than three memory chips.

Also, for the purposes of this disclosure, it is to be understood thatthat DRAM, NVRAM, 3D XPoint memory, and flash memory are techniques forindividual memory units, and that a memory chip for any one of thememory chips described herein can include a logic circuit for commandand address decoding as well as arrays of memory units of DRAM, NVRAM,3D XPoint memory, or flash memory. For example, a DRAM chip describedherein includes a logic circuit for command and address decoding as wellas an array of memory units of DRAM. Also, for example, a NVRAM chipdescribed herein includes a logic circuit for command and addressdecoding as well as an array of memory units of NVRAM. And, for example,a flash memory chip described herein includes a logic circuit forcommand and address decoding as well as an array of memory units offlash memory.

Also, a memory chip for any one of the memory chips described herein caninclude a cache or buffer memory for incoming and/or outgoing data. Insome embodiments, the memory units that implement the cache or buffermemory may be different from the units on the chip hosting the cache orbuffer memory. For example, the memory units that implement the cache orbuffer memory can be memory units of SRAM.

Each of the chips in the string of memory chips can be connected to theimmediate downstream and/or upstream chip via wiring, e.g., peripheralcomponent interconnect express (PCIe) or serial advanced technologyattachment (SATA). Each of the connections between the chips in thestring of memory chips can be connected sequentially with wiring and theconnections can be separate from each other. Each chip in the string ofmemory chips can include one or more sets of pins for connecting to anupstream chip and/or downstream chip in the string. In some embodiments,each chip in the string of memory chips can include a single integratedcircuit (IC) enclosed within an IC package. In such embodiments, the ICpackage can include the sets of pins on the boundaries of the package.

The first memory chip (e.g., DRAM chip) in the string of memory chips ofthe memory for the processor chip or the SoC can include a portion thatcan be configured, such as by the processor chip or SoC, as the cachefor the second memory chip (e.g., NVRAM chip) in the string of memorychips. A portion of the memory units in the first memory chip can beused as the cache memory for the second memory chip.

The second memory chip in the string of memory chips of the memory forthe processor chip or the SoC can include a portion that can beconfigured, such as by the first memory chip directly and the processorchip or SoC indirectly, as the buffer for accessing the third memorychip (e.g., flash memory chip) in the string of memory chips. A portionof the memory units in the second memory chip can be used as the bufferfor accessing the third memory chip. Also, the second memory chip caninclude a portion that can be configured, such as by the first memorychip directly and the processor chip or SoC indirectly, as a table forlogical-to-physical address mapping (logical-to-physical table) or aslogical-to-physical address mapping in general. A portion of the memoryunits in the second memory chip can be used for the logical-to-physicaladdress mapping.

The third memory chip in the string of memory chips of the memory forthe processor chip or the SoC can include a controller that can use thelogical-to-physical address mapping in the second memory chip to managea translation layer (e.g., flash translation layer function) of thethird memory chip. The translation layer of the third memory chip caninclude logical-to-physical address mapping such as a copy or derivativeof the logical-to-physical address mapping in the second memory chip.

Also, in some embodiments, the processor chip or SoC connected to thememory can configure the locations and the sizes of the cache in thefirst memory chip, the buffer and the logical-to-physical addressmapping in the second memory chip, as well as cache policy parameters(e.g., write through vs write back) in the first chip by writing datainto the first memory chip. And, the aforesaid configurations andsettings by the processor chip or SoC can be delegated to a second dataprocessing chip so that such tasks are removed from the processor chipor SoC. For example, the memory having the string of memory chips canhave a dedicated controller separate from the processor chip or SoCconfigured to provide and control the aforesaid configurations andsettings for the memory.

In general, with the techniques described herein to provide flexibleprovisioning of multi-tier memory, the flexibility to allocate a portionof memory units on certain memory chips in the string of chips as acache or a buffer is how the memory chips (e.g., the DRAM, NVRAM, andflash memory chips) are configured to make the connectivity workable andflexible. The cache and buffer operations allow downstream memorydevices of different sizes and/or different types to be connected to theupstream devices, and vice versa. In a sense, some functionalities of amemory controller are implemented in the memory chips to enable theoperations of cache and buffer in the memory chips.

FIG. 1 illustrates an example memory system 100 that is configured toprovide flexible provisioning of multi-tier memory, in accordance withsome embodiments of the present disclosure. The memory system 100includes a first memory chip 104 in a string of memory chips 102 of amemory. The memory system 100 also includes a second memory chip 106 inthe string of memory chips 102 and a third memory chip 108 in the stringof memory chips.

In FIG. 1, the first memory chip 104 is directly wired to the secondmemory chip 106 (e.g., see wiring 124) and is configured to interactdirectly with the second memory chip. Also, the second memory chip 106is directly wired to the third memory chip 108 (e.g., see wiring 126)and is configured to interact directly with the third memory chip.

Also, each chip in the string of memory chips 102 can include one ormore sets of pins for connecting to an upstream chip and/or downstreamchip in the string (e.g., see sets of pins 132, 134, 136, and 138). Insome embodiments, each chip in the string of memory chips (e.g., seestring of memory chips 102 or string of groups of memory chips 402 shownin FIG. 4) can include a single IC enclosed within a IC package. Forexample, set of pins 132 is part of first memory chip 104 and connectsfirst memory chip 104 to second memory chip 106 via wiring 124 and setof pins 134 that is part of second memory chip 106. The wiring 124connects the two sets of pins 132 and 134. Also, for example, set ofpins 136 is part of second memory chip 106 and connects second memorychip 106 to third memory chip 108 via wiring 126 and set of pins 138that is part of third memory chip 108. The wiring 126 connects the twosets of pins 136 and 138.

Also, as shown, the first memory chip 104 includes a cache 114 for thesecond memory chip 106. And, the second memory chip 106 includes abuffer 116 for the third memory chip 108 as well as logical-to-physicalmapping 118 for the third memory chip 108.

The cache 114 for the second memory chip 106 can be configured by aprocessor chip or a memory controller chip (e.g., see processor chip 202shown in FIG. 2 and memory controller chip 302 shown in FIG. 3).Locations and the sizes of the cache 114 in the first memory chip 104can be configured by the processor chip or memory controller chip bycorresponding data being written into the first memory chip by theprocessor or memory controller chip. Also, cache policy parameters ofthe cache 114 in the first memory chip 104 can be configured by theprocessor or memory controller chip by corresponding data being writteninto the first memory chip by the processor or the memory controllerchip.

The buffer 116 for the third memory chip 108 can be configured by aprocessor chip or a memory controller chip (e.g., see processor chip 202shown in FIG. 2 and memory controller chip 302 shown in FIG. 3).Locations and the sizes of the buffer 116 in the second memory chip 106can be configured by the processor chip or memory controller chip bycorresponding data being written into the second memory chip by theprocessor or memory controller chip, such as indirectly via the firstmemory chip 104. Also, buffer policy parameters of the buffer 116 in thesecond memory chip 106 can be configured by the processor or memorycontroller chip by corresponding data being written into the secondmemory chip by the processor or the memory controller chip, such asindirectly via the first memory chip 104.

The logical-to-physical mapping 118 for the third memory chip 108 can beconfigured by a processor chip or a memory controller chip (e.g., seeprocessor chip 202 shown in FIG. 2 and memory controller chip 302 shownin FIG. 3). Locations and the sizes of the logical-to-physical mapping118 in the second memory chip 106 can be configured by the processorchip or memory controller chip by corresponding data being written intothe second memory chip by the processor or memory controller chip, suchas indirectly via the first memory chip 104. Also, buffer policyparameters of the logical-to-physical mapping 118 in the second memorychip 106 can be configured by the processor or memory controller chip bycorresponding data being written into the second memory chip by theprocessor or the memory controller chip, such as indirectly via thefirst memory chip 104.

In some embodiments, the third memory chip 108 can have a lowest memorybandwidth of the chips in the string. In some embodiments, the firstmemory chip 104 can have a highest memory bandwidth of the chips in thestring. In such embodiments, the second memory chip 106 can have a nexthighest memory bandwidth of the chips in the string, such that the firstmemory chip 104 has a highest memory bandwidth of the chips in thestring and the third memory chip 108 has a lowest memory bandwidth ofthe chips in the string.

In some embodiments, the first memory chip 104 is or includes a DRAMchip. In some embodiments, the first memory chip 104 is or includes aNVRAM chip. In some embodiments, the second memory chip 106 is orincludes a DRAM chip. In some embodiments, the second memory chip 106 isor includes a NVRAM chip. In some embodiments, the third memory chip 108is or includes a DRAM chip. In some embodiments, the third memory chip108 is or includes a NVRAM chip. And, in some embodiments, the thirdmemory chip 108 is or includes a flash memory chip.

In embodiments having one or more DRAM chips, a DRAM chip can include alogic circuit for command and address decoding as well as arrays ofmemory units of DRAM. Also, a DRAM chip described herein can include acache or buffer memory for incoming and/or outgoing data. In someembodiments, the memory units that implement the cache or buffer memorycan be different from the DRAM units on the chip hosting the cache orbuffer memory. For example, the memory units that implement the cache orbuffer memory on the DRAM chip can be memory units of SRAM.

In embodiments having one or more NVRAM chips, a NVRAM chip can includea logic circuit for command and address decoding as well as arrays ofmemory units of NVRAM such as units of 3D XPoint memory. Also, a NVRAMchip described herein can include a cache or buffer memory for incomingand/or outgoing data. In some embodiments, the memory units thatimplement the cache or buffer memory can be different from the NVRAMunits on the chip hosting the cache or buffer memory. For example, thememory units that implement the cache or buffer memory on the NVRAM chipcan be memory units of SRAM.

In some embodiments, NVRAM chips can include a cross-point array ofnon-volatile memory cells. A cross-point array of non-volatile memorycan perform bit storage based on a change of bulk resistance, inconjunction with a stackable cross-gridded data access array.Additionally, in contrast to many flash-based memories, cross-pointnon-volatile memory can perform a write in-place operation, where anon-volatile memory cell can be programmed without the non-volatilememory cell being previously erased.

As mentioned herein, NVRAM chips can be or include cross point storageand memory devices (e.g., 3D XPoint memory). A cross point memory deviceuses transistor-less memory elements, each of which has a memory celland a selector that are stacked together as a column. Memory elementcolumns are connected via two perpendicular lays of wires, where one layis above the memory element columns and the other lay below the memoryelement columns. Each memory element can be individually selected at across point of one wire on each of the two layers. Cross point memorydevices are fast and non-volatile and can be used as a unified memorypool for processing and storage.

In embodiments having one or more flash memory chips, a flash memorychip can include a logic circuit for command and address decoding aswell as arrays of memory units of flash memory such as units ofNAND-type flash memory. Also, a flash memory chip described herein caninclude a cache or buffer memory for incoming and/or outgoing data. Insome embodiments, the memory units that implement the cache or buffermemory can be different from the flash memory units on the chip hostingthe cache or buffer memory. For example, the memory units that implementthe cache or buffer memory on the flash memory chip can be memory unitsof SRAM.

Also, for example, an embodiment of the string of memory chips caninclude DRAM to DRAM to NVRAM, or DRAM to NVRAM to NVRAM, or DRAM toflash memory to flash memory; however, DRAM to NVRAM to flash memory mayprovide a more effective solution for a string of memory chips beingflexibly provisioned as multi-tier memory.

Also, for the purposes of this disclosure, it is to be understood thatthat DRAM, NVRAM, 3D XPoint memory, and flash memory are techniques forindividual memory units, and that a memory chip for any one of thememory chips described herein can include a logic circuit for commandand address decoding as well as arrays of memory units of DRAM, NVRAM,3D XPoint memory, or flash memory. For example, a DRAM chip describedherein includes a logic circuit for command and address decoding as wellas an array of memory units of DRAM. For example, a NVRAM chip describedherein includes a logic circuit for command and address decoding as wellas an array of memory units of NVRAM. For example, a flash memory chipdescribed herein includes a logic circuit for command and addressdecoding as well as an array of memory units of flash memory.

Also, a memory chip for any one of the memory chips described herein caninclude a cache or buffer memory for incoming and/or outgoing data. Insome embodiments, the memory units that implement the cache or buffermemory may be different from the units on the chip hosting the cache orbuffer memory. For example, the memory units that implement the cache orbuffer memory can be memory units of SRAM.

FIG. 2 illustrates the example memory system 100 and processor chip 202configured to provide flexible provisioning of multi-tier memory, inaccordance with some embodiments of the present disclosure. In FIG. 2,the processor chip 202 is directly wired (e.g., see wiring 204) to thefirst memory chip 104 and is configured to interact directly with thefirst memory chip.

In some embodiments, the processor chip 202 includes or is a SoC. A SoCdescribe herein can be or include an integrated circuit or chip thatintegrates any two or more components of a computing device. The two ormore components can include at least one or more of a central processingunit (CPU), graphics processing unit (GPU), memory, input/output ports,and secondary storage. For example, an SoC described herein can alsoinclude a CPU, a GPU, graphics and memory interfaces, hard-disk, USBconnectivity, random-access memory, read-only memory, secondary storage,or any combination thereof on a single circuit die. Also, where theprocessor chip 202 is a SoC, the SoC includes at least a CPU and/or aGPU.

For an SoC described herein, the two or more components can be embeddedon a single substrate or microchip (chip). In general, a SoC isdifferent from a conventional motherboard-based architecture in that theSoC integrates all of its components into a single integrated circuit;whereas a motherboard houses and connects detachable or replaceablecomponents. Because the two or more components are integrated on asingle substrate or chip, SoCs consume less power and take up much lessarea than multi-chip designs with equivalent functionality. Thus, insome embodiments, the memory systems described herein can be connectedwith or be a part of SoCs in mobile computing devices (such as insmartphones), embedded systems, and the Internet of Things devices.

The processor chip 202 can be configured to configure the cache 114 forthe second memory chip 106. The processor chip 202 can also beconfigured to configure locations and the sizes of the cache 114 bywriting corresponding data into the first memory chip 104. The processorchip 202 can also be configured to configure cache policy parameters bywriting corresponding data into the first memory chip 104.

Also, the processor chip 202 can configured to configure the buffer 116for the third memory chip 108 and/or the logical-to-physical mapping 118for the third memory chip. The processor chip 202 can also be configuredto configure locations and sizes of the buffer 116 by writingcorresponding data into the first memory chip 104. The processor chip202 can also be configured to configure locations and the sizes of thelogical-to-physical mapping 118 by writing corresponding data into thefirst memory chip 104.

FIG. 3 illustrates the example memory system 100 and memory controllerchip 302 configured to provide flexible provisioning of multi-tiermemory, in accordance with some embodiments of the present disclosure.In FIG. 3, the memory controller chip 302 is directly wired (e.g., seewiring 304) to the first memory chip 104 and is configured to interactdirectly with the first memory chip.

In some embodiments, the memory controller chip 302 includes or is aSoC. Such a SoC can be or include an integrated circuit or chip thatintegrates any two or more components of a computing device. The two ormore components can include at least one or more of a separate memory,input/output ports, and separate secondary storage. For example, the SoCcan include memory interfaces, hard-disk, USB connectivity,random-access memory, read-only memory, secondary storage, or anycombination thereof on a single circuit die. Also, where the memorycontroller chip 302 is a SoC, the SoC includes at least a dataprocessing unit.

The memory controller chip 302 can be configured to configure the cache114 for the second memory chip 106. The memory controller chip 302 canalso be configured to configure locations and the sizes of the cache 114by writing corresponding data into the first memory chip 104. The memorycontroller chip 302 can also be configured to configure cache policyparameters by writing corresponding data into the first memory chip 104.

Also, the memory controller chip 302 can configured to configure thebuffer 116 for the third memory chip 108 and/or the logical-to-physicalmapping 118 for the third memory chip. The memory controller chip 302can also be configured to configure locations and sizes of the buffer116 by writing corresponding data into the first memory chip 104. Thememory controller chip 302 can also be configured to configure locationsand the sizes of the logical-to-physical mapping 118 by writingcorresponding data into the first memory chip 104.

FIG. 4 illustrates an example memory system 400 configured to provideflexible provisioning of multi-tier memory with tiers that each includemultiple memory chips, in accordance with some embodiments of thepresent disclosure. The memory system 400 includes a string of groups ofmemory chips 402. The string of groups of memory chips 402 includes afirst group of memory chips including a first type of memory chips(e.g., see memory chips 404 a and 404 b which are the same type ofchips). The string of groups of memory chips 402 includes a second groupof memory chips including the first type of memory chips or a secondtype of memory chips (e.g., see memory chips 406 a and 406 b which arethe same type of chips). The string of groups of memory chips 402 alsoincludes a third group of memory chips including a first type of memorychips, a second type of memory chips, or a third type of memory chips(e.g., see memory chips 408 a and 408 b which are the same type ofchips). The first type of memory chips can be or include DRAM chips. Thesecond type of memory chips can be or include NVRAM chips. The thirdtype of memory chips can be or include flash memory chips.

Also, as shown in FIG. 4, the chips in the first group of memory chipsare directly wired to the chips in the second group of memory chips viawiring 424 and are configured to interact directly with one or more ofthe chips in the second group of memory chips. Also, as shown in FIG. 4,the chips in the second group of memory chips are directly wired to thechips in the third group of memory chips via wiring 426 and areconfigured to interact directly with one or more of the chips in thethird group of memory chips.

Also, as shown in FIG. 4, each chip in the first group of memory chipsincludes a cache (e.g., see cache 414) for the second group of memorychips. And, each chip in the second group of memory chips includes abuffer 416 for the third group of memory chips as well aslogical-to-physical mapping 418 for the third group of memory chips.

In some embodiments, each chip in the third group of memory chips (e.g.,see memory chips 408 a and 408 b) can have a lowest memory bandwidthrelative to the other chips in the string of groups of memory chips 402.In some embodiments, each chip in the first group of memory chips (e.g.,see memory chips 404 a and 404 b) can have a highest memory bandwidthrelative to the other chips in the string of groups of memory chips 402.In such embodiments, each chip in the second group of memory chips(e.g., see memory chips 406 a and 406 b) can have a next highest memorybandwidth relative to other chips in the string of groups of memorychips 402, such that each chip in the first group of memory chips has ahighest memory bandwidth and each chip in the third group of memorychips has a lowest memory bandwidth.

In some embodiments, the first group of memory chips (e.g., see memorychips 404 a and 404 b) can include DRAM chips or NVRAM chips. In someembodiments, the second group of memory chips (e.g., see memory chips406 a and 406 b) can include DRAM chips or NVRAM chips. In someembodiments, the third group of memory chips (e.g., see memory chips 408a and 408 b) can include DRAM chips, NVRAM chips, or flash memory chips.

As shown in FIGS. 1-4, the present disclosure is directed to flexibleprovisioning of a string of memory chips (e.g., see string of memorychips 102 shown in FIGS. 1-3 or string of groups of memory chips 402shown in FIG. 4). And, the flexible provisioning of the string of memorychips forms a memory (e.g., see memory system 100 shown in FIG. 2 ormemory system 400 shown in FIG. 4).

A memory system disclosed herein, such as memory system 100 or 400, canbe its own apparatus or within its own packaging.

In some embodiments, a memory system disclosed herein, such as memorysystem 100 or 400, can be combined with and for a processor chip or SoC(e.g., see FIG. 2). When combined with and for a processor chip or SoC,the memory system and the processor chip or SoC can be a part of asingle apparatus and/or combined into a single packaging.

Also, in some embodiments, a memory system disclosed herein, such asmemory system 100 or 400, can be combined with a memory controller chip(e.g., see FIG. 3). When combined with a memory controller chip, thememory system and the memory controller chip can be a part of a singleapparatus and/or combined into a single packaging. Alternatively, eachchip in the string of chips, or at least the first memory chip and thesecond memory chip, can include a respective memory controller providingsimilar functionality to the memory controller chip shown in FIG. 3.

From the perspective of the processor chip or SoC wired to the memory(e.g., see processor chip 202 shown in FIG. 2) or the memory controllerchip (e.g., see memory controller chip 302 shown in FIG. 3), the stringof memory chips of the memory appears no different from a single memorychip implementation; however, with the flexible provisioning, benefitsof using a string of memory chips is achieved. In such embodiments, theprocessor chip or SoC—or the memory controller chip—can be directlywired (e.g., see wiring 204 shown in FIG. 2 or wiring 304 shown in FIG.3) to a first memory chip (e.g., see first memory chip 104) in thestring of memory chips 102 and can interact with the first memory chipwithout perceiving the memory chips in the string downstream of thefirst memory chip (e.g., see second memory chip 106 and third memorychip 108 which are downstream of the first memory chip 104).

In the memory (e.g., see memory system 100 or 400), the first memorychip (e.g., see first memory chip 104 or one of memory chips 404 a or404 b) can be directly wired to a second memory chip (e.g., see secondmemory chip 106 or one of memory chips 406 a or 406 b) and can interactwith the second memory chip such that the processor chip, SoC, or memorycontroller chip (e.g., see processor chip 202 and memory controller chip302) gains the benefits of the string of the first and second memorychips without perceiving the second memory chip. And, the second memorychip (e.g., see first memory chip 104 or one of memory chips 404 a or404 b) can be directly wired to a third memory chip (e.g., see thirdmemory chip 108 or one of memory chips 408 a or 408 b) and so forth suchthat the processor chip, SoC, or memory controller chip gains benefitsof the string of multiple memory chips (e.g., see string of memory chips102 or string of groups of memory chips 402) without perceiving andinteracting with the multiple memory chips downstream of the firstmemory chip. Also, in some embodiments, each chip in the stringperceives and interacts with an immediate upstream chip and downstreamchip in the string without perceiving chips in the string furtherupstream or downstream.

As mentioned, with the flexible provisioning, benefits of using a stringof memory chips with a memory hierarchy can be achieved. Thus, forexample, in some embodiments, the first memory chip (e.g., see firstmemory chip 104) in the string can be a chip with the highest memorybandwidth in the memory. The second memory chip (e.g., see second memorychip 106) in the string immediately downstream of the first chip can bea chip with next highest memory bandwidth of the memory (which may haveother benefits such as being cheaper to manufacture than the first chipor be more reliable or persistent at storing data than the first chip).The third memory chip (e.g., see third memory chip 108) in the stringimmediately downstream of the second chip (or the final downstream chipin the string where the string has more than three memory chips) canhave the lowest memory bandwidth. The third memory chip in such examples(or the final downstream chip in other examples with more than threememory chips) can be the most cost-effective chip or most reliable orpersistent chip for storing data.

In some embodiments, the first memory chip in the string can be a DRAMchip. In such embodiments, the second memory chip in the stringimmediately downstream of the first chip can be a NVRAM chip (e.g., a 3DXPoint memory chip). And, in such embodiments, the third memory chip inthe string immediately downstream of the second chip can be a flashmemory chip (e.g., a NAND-type flash memory chip).

As mentioned, for the sake of understanding the flexible provisioning ofa string of memory chips disclosed here, examples often refer to athree-chip string of memory chips (e.g., see string of memory chips 102shown in FIGS. 1-3 and string of groups of memory chips 402 shown inFIG. 4); however, it is to be understood that the string of memory chipscan include more than three memory chips or more than three groups ofchips where each of the groups is a tier of chips.

As mentioned, some embodiments of string of memory chips can include aDRAM memory chip that is the first chip in the string, a NVRAM chip thatis the second chip in the string, and a flash memory chip (e.g.,NAND-type flash memory chip) that is the third chip in the string andcan be used as the bulk memory chip in the string. In such embodimentsand in other embodiments with other arrangements of memory chip types,each of the chips in the string of memory chips are connected to theimmediate downstream and/or upstream chip via wiring (e.g., PCIe orSATA). Each of the connections between the chips in the string of memorychips can be connected sequentially with wiring and the connections canbe separate from each other (e.g., see wiring 124 and 126 as well aswiring 424 and 426). Also, each chip in the string of memory chips caninclude one or more sets of pins for connecting to an upstream chipand/or downstream chip in the string (e.g., see sets of pins 132, 134,136, and 138 depicted in FIG. 1). In some embodiments, each chip in thestring of memory chips (e.g., see string of memory chips 102 or stringof groups of memory chips 402) can include a single IC enclosed within aIC package. In such embodiments, the IC package can include the sets ofpins on the boundaries of the package (such as sets of pins 132, 134,136, and 138).

The first memory chip (e.g., DRAM chip) in the string of memory chips ofthe memory for the processor chip or the SoC can include a portion thatcan be configured, such as by the processor chip or SoC, as the cachefor the second memory chip (e.g., NVRAM chip) in the string (e.g., seecache 114 for the second memory chip). A portion of the memory units inthe first memory chip can be used as the cache memory for the secondmemory chip.

The second memory chip in the string of memory chips of the memory forthe processor chip or the SoC can include a portion that can beconfigured, such as by the first memory chip directly and the processorchip or SoC indirectly, as the buffer for accessing the third memorychip (e.g., flash memory chip) in the string (e.g., see buffer for thethird memory chip 116). A portion of the memory units in the secondmemory chip can be used as the buffer for accessing the third memorychip. Also, the second memory chip can include a portion that can beconfigured, such as by the first memory chip directly and the processorchip or SoC indirectly, as a table for logical-to-physical addressmapping (logical-to-physical table) or as logical-to-physical addressmapping in general (e.g., see logical-to-physical mapping 118). Aportion of the memory units in the second memory chip can be used forthe logical-to-physical address mapping.

The third memory chip in the string of memory chips of the memory forthe processor chip or the SoC can include a controller (e.g., seecontroller 128) that can use the logical-to-physical address mapping inthe second memory chip to manage a translation layer (e.g., flashtranslation layer function) of the third memory chip (e.g., seetranslation layer 130). The translation layer of the third memory chipcan include logical-to-physical address mapping such as a copy orderivative of the logical-to-physical address mapping in the secondmemory chip.

Also, in some embodiments, the processor chip or SoC connected to thememory (e.g., see processor chip 202) can configure the locations andthe sizes of the cache in the first memory chip, the buffer and thelogical-to-physical address mapping in the second memory chip, as wellas cache policy parameters (e.g., write through vs write back) in thefirst chip by writing data into the first memory chip (e.g., see firstmemory chip 104). And, the aforesaid configurations and settings by theprocessor chip or SoC can be delegated to a second data processing chipso that such tasks are removed from the processor chip or SoC (e.g., seememory controller chip 302 shown in FIG. 3). For example, the memoryhaving the string of memory chips can have a dedicated controllerseparate from the processor chip or SoC configured to provide andcontrol the aforesaid configurations and settings for the memory (e.g.,see memory controller chip 302).

For the purposes of this disclosure it is to be understood that a memorychip in the string of memory chips can be replaced by a group of similarmemory chips, such that the string includes a string of groups ofsimilar chips (e.g., see string of groups of memory chips 402 shown inFIG. 4). In such examples, each group of similar chips is a node in thestring. Also, in some embodiments, the nodes of the string of memorychips can be made up of a combination of single chip nodes and multiplechip nodes (not depicted in the drawings). For example, in the string ofmemory chips, the first memory chip (e.g., DRAM chip) can be replaced bya group of similar memory chips (e.g., a group of DRAM chips), thesecond memory chip (e.g., NVRAM chip) can be replaced by a group ofsimilar memory chips (e.g., a group of NVRAM chips), the third memorychip (e.g., flash memory chip) can be replaced by a group of similarmemory chips (e.g., a group of flash memory chips), or some combinationthereof.

FIG. 5 illustrates example parts of an example computing device 500, inaccordance with some embodiments of the present disclosure. Thecomputing device 500 can be communicatively coupled to other computingdevices via the computer network 502 as shown in FIG. 5. The computingdevice 500 includes at least a bus 504, a processor 506 (such as a CPUand/or the processor chip 202 shown in FIG. 2), a main memory 508, anetwork interface 510, and a data storage system 512. The bus 504communicatively couples the processor 506, the main memory 508, thenetwork interface 510, and the data storage system 512. The computingdevice 500 includes a computer system that includes at least processor506, main memory 508 (e.g., read-only memory (ROM), flash memory, DRAMsuch as synchronous DRAM (SDRAM) or Rambus DRAM (RDRAM), NVRAM, SRAM,etc.), and data storage system 512, which communicate with each othervia bus 504 (which can include multiple buses and wirings).

The main memory 508 can include the memory system 100 depicted inFIG. 1. Also, the main memory 508 can include the memory system 400depicted in FIG. 4. In some embodiments, the data storage system 512 caninclude the memory system 100 depicted in FIG. 1. And, the data storagesystem 512 can include the memory system 400 depicted in FIG. 4.

Processor 506 can represent one or more general-purpose processingdevices such as a microprocessor, a central processing unit, or thelike. The processor 506 can be or include the processor 202 depicted inFIG. 2. The processor 506 can be a complex instruction set computing(CISC) microprocessor, reduced instruction set computing (RISC)microprocessor, very long instruction word (VLIW) microprocessor, or aprocessor implementing other instruction sets, or processorsimplementing a combination of instruction sets. Processor 506 can alsobe one or more special-purpose processing devices such as an applicationspecific integrated circuit (ASIC), a field programmable gate array(FPGA), a digital signal processor (DSP), network processor, a processorin memory (PIM), or the like. Processor 506 can be configured to executeinstructions for performing the operations and steps discussed herein.Processor 506 can further include a network interface device such asnetwork interface 510 to communicate over one or more communicationsnetwork such as network 502.

The data storage system 512 can include a machine-readable storagemedium (also known as a computer-readable medium) on which is stored oneor more sets of instructions or software embodying any one or more ofthe methodologies or functions described herein. The instructions canalso reside, completely or at least partially, within the main memory508 and/or within the processor 506 during execution thereof by thecomputer system, the main memory 508 and the processor 506 alsoconstituting machine-readable storage media.

While the memory, processor, and data storage parts are shown in theexample embodiment to each be a single part, each part should be takento include a single part or multiple parts that can store theinstructions and perform their respective operations. The term“machine-readable storage medium” shall also be taken to include anymedium that is capable of storing or encoding a set of instructions forexecution by the machine and that cause the machine to perform any oneor more of the methodologies of the present disclosure. The term“machine-readable storage medium” shall accordingly be taken to include,but not be limited to, solid-state memories, optical media, and magneticmedia.

Referring back to the memory chip having the data mover, FIG. 6illustrates an example system 600 that includes a memory chip 602 havingan integrated data mover 608, in accordance with some embodiments of thepresent disclosure. In FIG. 6, the memory chip 602 includes a first setof pins 604 configured to allow the memory chip 602 to be coupled to afirst microchip or device 624 via first wiring 634. Also shown, thefirst microchip or device 624 has a set of pins 605 configured to allowthe first microchip or device 624 to be coupled to the memory chip 602via first wiring 634. The memory chip 602 also includes a second set ofpins 606 configured to allow the memory chip 602 to be coupled to asecond microchip or device 626 via second wiring 636 that is separatefrom the first wiring 634. Also shown, the second microchip or device626 has a set of pins 607 configured to allow the second microchip ordevice 626 to be coupled to the memory chip 602 via second wiring 636.The memory chip 602 also includes a data mover 608 configured tofacilitate access to the second microchip or device 626, via the secondset of pins 606, to read data from the second microchip or device 626and write data to the second microchip or device 626.

In general, the data mover 608 can combine data stored in the memorychip 602 on its way to the second microchip or device 626 using variousstrategies. This can improve write performance and endurance of thesecond microchip or device 626. For example, sequential or block accesson memory chips is orders of magnitude faster than random access onmemory chips. In some embodiments, data stored in a portion of memory610 of the memory chip 602 is accessible by or through the firstmicrochip or device 624 via the first set of pins 604. And, in suchembodiments, the data mover 608 is configured to combine the data storedin the portion of memory 610 of the memory chip 602 by moving the datain blocks to the second microchip or device 626. Thus, write performanceand endurance of the second microchip or device 626 is improved.

Also, in such embodiments and others, the blocks can be at a granularitythat is coarser than the data stored in the portion of memory 610 of thememory chip 602. The blocks being at a granularity that is coarser thanthe pre-blocked data in the memory chip 602, such as the data to beaccessed by first microchip or device, can reduce the frequency of datawrites to the second microchip or device.

In some embodiments, such as shown in FIG. 6, data stored in a portionof memory 610 of the memory chip 602 can be accessible by or through thefirst microchip or device 624 via the first set of pins 604. Also, whenthe data stored in the portion of memory 610 of the memory chip 602 isaccessible through the first microchip or device 624 it is beingaccessed by another memory chip or device or a processor chip or device(which not depicted in FIG. 6 but is shown in FIGS. 2 and 3 to someextent wherein the second memory chip 106 is acting as the memory chip602). And, the first microchip or device 624 can read data from thememory chip 602 as well as write data to the memory chip 602.

In some embodiments, such as shown in FIG. 6, data stored in a portionof memory 630 of the second microchip or device 626 can be accessible byor through the memory chip 602 via the second set of pins 606. Also,when the data stored in the portion of memory 630 of the secondmicrochip or device 626 is accessible through the memory chip 602 it isbeing accessed by another memory chip or device or a processor chip ordevice (such as the first microchip or device 624). And, the memory chip602 can read data from the second microchip or device 626 as well aswrite data to the second microchip or device 626.

In some embodiments, such as shown in FIG. 6, the data mover 608 isconfigured to buffer movement of changes to the data stored in theportion of memory 610 of the memory chip 602. Also, the data mover 608is configured to send write requests to the second microchip or device626 in a suitable size due to the buffering by the data mover 608.

When the write to the second microchip or device 626 is in the suitablesize due to the buffering by the data mover 608, the second microchip ordevice can erase a block and program the block in the second microchipor device according to the write without further processing or minimalprocessing in the second microchip or device. This is one example waythat the data mover 608 integrated in the memory chip 602 can improvewrite performance and endurance of the second microchip or device. Also,with the buffering by the data mover 608 and when frequent and/or randomchanges are made to the data in a portion of the memory chip 602 (suchas the data in the portion of memory 610 accessible by the firstmicrochip or device), the second microchip or device 626 does not haveto be frequently erased and reprogrammed in a corresponding way as thechanges occurring in the memory chip 602.

The buffering by the data mover 608 is even more beneficial when thesecond microchip or device 626 is a flash memory chip because thebuffering can remove or at least limit the effects of writeamplification that occurs in flash memory. Write amplification can bereduced or even eliminated by the buffering because, with the buffering,a write request sent by the memory chip 602 can be modified to asuitable size or granularity expected by the receiving flash memorychip. Thus, the flash memory chip can erase a block and program theblock according to the write request without possible duplication of thewrite and thus avoid further processing in the second microchip ordevice 626.

Also, the data mover 608 can be configured to bundle changed addressesin the changes to the data stored in the portion of memory 610 of thememory chip 602. And, the data mover 608 can be configured to writebundled changed addresses into another portion of the memory chip 602 tobe moved to the second microchip or device 626 via a write request tothe second microchip or device 626. The bundling by the data mover 608can improve the buffering by the data mover and the sending of writerequests according to the buffering since the bundling of changedaddresses can be controlled by the data mover to correspond to asuitable size or granularity expected by the receiving second microchipor device 626.

In some embodiments, such as shown in FIG. 6, the memory chip 602includes logical-to-physical mapping 612 for the second microchip ordevice 626 that is configured to use the bundled changed addresses asinput.

FIG. 7 illustrates an example system 700 that includes the memory chip602 shown in FIG. 6 as well as a microchip or device that receives datatransferred from the data mover and has logical-to-physical mapping formapping the received data (e.g., see logical-to-physical mapping 712),in accordance with some embodiments of the present disclosure. Thesystem 700 is similar to the system 600, except in system 700, thelogical-to-physical mapping 712 for the second microchip or device 626is provided in the second microchip or device 626. This is instead ofproviding the logical-to-physical mapping for the second microchip ordevice on the memory chip 602 (e.g., see logical-to-physical mapping 612depicted in FIG. 6).

With embodiments similar to system 700, the second microchip or device626 includes logical-to-physical mapping 712 for itself. And, thelogical-to-physical mapping 712 is configured to use the bundled changedaddresses as input once the bundled changed addresses are sent from thedata mover 608 of the memory chip 602 in a write request to the secondmicrochip or device 626. To put it another way, once the bundled changedaddresses are received by the second microchip or device 626 from thedata mover 608 of the memory chip 602 in a write request to the secondmicrochip or device 626, the logical-to-physical mapping 712 isconfigured to use the bundled changed addresses as input.

FIG. 8 illustrates an example system 800 that includes the memory chip602 shown in FIG. 6 which is also shown having encryption andauthentication circuitry (e.g., see encryption engine 802 and gatekeeper804), in accordance with some embodiments of the present disclosure. Asshown in FIG. 8, in some embodiments, the memory chip 602 includes anencryption engine 802 configured to secure data to be moved to thesecond microchip or device 626 for long term storage. Also, as shown, insuch embodiments, the memory chip 602 includes a gatekeeper 804,configured to provide an authentication process for access of thesecured data stored in the second microchip or device 626. Also, thegatekeeper 804 can be configured to decrypt the secured data accordingto the authentication process. In some other embodiments, the encryptionengine can be hosted on another chip or device instead of being hostedon the memory chip 602.

FIGS. 7 and 8 also depict other components that are illustrated in FIG.6. For example, FIGS. 7 and 8 depict the memory chip 602 that includes afirst set of pins 604 configured to allow the memory chip 602 to becoupled to a first microchip or device 624 via first wiring 634. Alsoshown in FIGS. 7 and 8, the first microchip or device 624 has a set ofpins 605 configured to allow the first microchip or device 624 to becoupled to the memory chip 602 via first wiring 634. Also shown in FIGS.7 and 8, the memory chip 602 also includes a second set of pins 606configured to allow the memory chip 602 to be coupled to a secondmicrochip or device 626 via second wiring 636 that is separate from thefirst wiring 634. Also shown, the second microchip or device 626 has aset of pins 607 configured to allow the second microchip or device 626to be coupled to the memory chip 602 via second wiring 636. The memorychip 602 also includes a data mover 608 configured to facilitate accessto the second microchip or device 626, via the second set of pins 606,to read data from the second microchip or device 626 and write data tothe second microchip or device 626.

With respect to the systems shown in FIGS. 6-8, the memory chip 602 canbe a NVRAM chip, and with such embodiments, the memory chip 602 includesa plurality of NVRAM cells. The plurality of NVRAM cells in suchexamples can be or include a plurality of 3D XPoint memory cells.Alternatively, the memory chip 602 can be a dynamic DRAM chip, and withsuch embodiments, the memory chip 602 includes a plurality of DRAMcells. Also, the memory chip 602 can be a flash memory chip, and withsuch embodiments, the memory chip 602 includes a plurality of flashmemory cells. The plurality of flash memory cells in such embodimentscan be or include a plurality of NAND-type flash memory cells.

The second microchip or device 626 can be another memory chip or amemory device. In some embodiments, for example, the second microchip ordevice 626 is a DRAM chip. In some embodiments, for example, the secondmicrochip or device 626 is a NVRAM chip. In some embodiments, forexample, the second microchip or device 626 is a flash memory chip(e.g., a NAND-type flash memory chip).

Some embodiments can include a system having an intermediate memory chip(e.g., see memory chip 602 shown in FIG. 6), a first memory chip (e.g.,see first microchip or device 624), and a second memory chip (e.g., seesecond microchip or device 626). And, in such embodiments, theintermediate memory chip includes a first set of pins (e.g., see firstset of pins 604) configured to allow the intermediate memory chip to becoupled to the first memory chip via first wiring (e.g., see wiring634). The intermediate memory chip can also include a second set of pins(e.g., see second set of pins 606) configured to allow the intermediatememory chip to be coupled to the second memory chip via second wiring(e.g., see wiring 636) that is separate from the first wiring. And, theintermediate memory chip can include a data mover (e.g., see data mover608) configured to facilitate access to the second memory chip, via thesecond set of pins, to read data from the second memory chip and writedata to the second memory chip.

In such embodiments, the intermediate memory chip can be a NVRAM chip,wherein the NVRAM chip includes a plurality of NVRAM cells.Alternatively, the intermediate memory chip can be a DRAM chip, whereinthe DRAM chip includes a plurality of DRAM cells. The plurality of NVRAMcells in such examples can be or include a plurality of 3D XPoint memorycells.

Also, in such embodiments, the second memory chip can be a flash memorychip, wherein the flash memory chip includes a plurality of flash memorycells. The plurality of flash memory cells in such embodiments can be orinclude a plurality of NAND-type flash memory cells. Alternatively, thesecond memory chip can be a NVRAM chip, wherein the NVRAM chip includesa plurality of NVRAM cells. The plurality of NVRAM cells in suchexamples can be or include a plurality of 3D XPoint memory cells. Also,the second memory chip can be a DRAM chip, wherein the DRAM chipincludes a plurality of DRAM cells.

Also, in such embodiments, the first memory chip can be a DRAM chip,wherein the DRAM chip includes a plurality of DRAM cells. Alternatively,the first memory chip can be a NVRAM chip, wherein the NVRAM chipincludes a plurality of NVRAM cells. The plurality of NVRAM cells insuch examples can be or include a plurality of 3D XPoint memory cells.

Some embodiments can include a system having an intermediate memory chip(e.g., see memory chip 602 shown in FIG. 6), a second memory chip (e.g.,see second microchip or device 626), and a processor chip, such as a SoC(e.g., see first microchip or device 624). In such embodiments, theintermediate memory chip includes a first set of pins (e.g., see firstset of pins 604) configured to allow the intermediate memory chip to becoupled to the processor chip via first wiring (e.g., see wiring 634).Also, the intermediate memory chip can include a second set of pins(e.g., see second set of pins 606) configured to allow the intermediatememory chip to be coupled to the second memory chip via second wiring(e.g., see wiring 636) that is separate from the first wiring. And, theintermediate memory chip can include a data mover (e.g., see data mover608) configured to facilitate access to the second memory chip, via thesecond set of pins and the second wiring, to read data from the secondmemory chip and write data to the second memory chip.

In some embodiments, one or more instances of the memory chip 602 (suchas the different instances of the memory chip 602 shown in FIGS. 6-8)can be used as one or more memory chips in flexible provisioning of thestring of memory chips 102 shown in FIGS. 1-3. Also, one or moreinstances of the memory chip 602 can be used as one or more memory chipsin flexible provisioning of the string of memory chips 402 shown in FIG.4.

Also, the system having the intermediate memory chip (e.g., see memorychip 602 shown in FIG. 6), the first memory chip (e.g., see firstmicrochip or device 624), and the second memory chip (e.g., see secondmicrochip or device 626) can be included in the string of memory chips102 shown in FIGS. 1-3. For example, the memory chip 602 can be orinclude the second memory chip 106, the first microchip or device 624can be or include the first memory chip 104 and the second microchip ordevice 626 can be or include the third memory chip 108.

In some embodiments, the memory chip 602 can be or include the firstmemory chip 104 in the string of memory chips 102. In such embodiments,for example, the first microchip or device 624 can be or include theprocessor chip 202 shown in FIG. 2 or the memory controller chip 302shown in FIG. 3. Also, in such embodiments, the second microchip ordevice 626 can be or include the second memory chip 106 in the string ofmemory chips 102.

In some embodiments, any one or more of the systems 600, 700, and 800can be included in the main memory 508 and/or the data storage system512 shown in FIG. 5. In such embodiments and others, the first microchipor device 624 can be, be a part of, or include the processor 506.

Like the memory chip 602, any other of the memory chips described herein(e.g., see memory chips 104, 106, and 108) can include an encryptionengine and/or an authentication gatekeeper for securing data moved to orthrough the memory chip (e.g., see encryption engine 802 and gatekeeper804 shown in FIG. 8). Also, like the memory chip 602, any other of thememory chips described herein (e.g., see memory chips 104, 106, and 108)can include a data mover, such as the data mover 608.

In the foregoing specification, embodiments of the disclosure have beendescribed with reference to specific example embodiments thereof. Itwill be evident that various modifications can be made thereto withoutdeparting from the broader spirit and scope of embodiments of thedisclosure as set forth in the following claims. The specification anddrawings are, accordingly, to be regarded in an illustrative senserather than a restrictive sense.

What is claimed is:
 1. A memory chip, comprising: a first set of pinsconfigured to allow the memory chip to be coupled to a first microchipor device via first wiring; a second set of pins configured to allow thememory chip to be coupled to a second microchip or device via secondwiring that is separate from the first wiring; and a data moverconfigured to facilitate access to the second microchip or device, viathe second set of pins, to read data from the second microchip or deviceand write data to the second microchip or device.
 2. The memory chip ofclaim 1, wherein data stored in a portion of the memory chip isaccessible by or through the first microchip or device via the first setof pins.
 3. The memory chip of claim 2, wherein the data mover isconfigured to combine the data stored in the portion of the memory chipby moving the data in blocks to the second microchip or device.
 4. Thememory chip of claim 3, wherein the blocks are at a granularity that iscoarser than the data stored in the portion of the memory chip.
 5. Thememory chip of claim 4, wherein the data mover is configured to: buffermovement of changes to the data stored in the portion of the memorychip; and send write requests to the second microchip or device in asuitable size due to the buffering by the data mover.
 6. The memory chipof claim 5, wherein the data mover is configured to: bundle changedaddresses in the changes to the data stored in the portion of the memorychip; and write bundled changed addresses into another portion of thememory chip to be moved to the second microchip or device via a writerequest to the second microchip or device.
 7. The memory chip of claim5, comprising logical-to-physical mapping for the second microchip ordevice that is configured to use the bundled changed addresses as input.8. The memory chip of claim 5, wherein the second microchip or devicecomprises logical-to-physical mapping for itself that is configured touse the bundled changed addresses as input once the bundled changedaddresses are sent in a write request to the second microchip or device.9. The memory chip of claim 1, wherein the memory chip is a non-volatilerandom-access memory (NVRAM) chip, and wherein the memory chip comprisesa plurality of NVRAM cells.
 10. The memory chip of claim 9, wherein theplurality of NVRAM cells is a plurality of 3D XPoint memory cells. 11.The memory chip of claim 1, wherein the memory chip is a dynamicrandom-access memory (DRAM) chip, and wherein the memory chip comprisesa plurality of DRAM cells.
 12. The memory chip of claim 1, wherein thememory chip is a flash memory chip, and wherein the memory chipcomprises a plurality of flash memory cells.
 13. The memory chip ofclaim 12, wherein the plurality of flash memory cells is a plurality ofNAND-type flash memory cells.
 14. The memory chip of claim 1, comprisingan encryption engine configured to secure data to be moved to the secondmicrochip or device for long term storage.
 15. The memory chip of claim14, comprising a gatekeeper, configured to: provide an authenticationprocess for access of the secured data stored in the second microchip ordevice; and decrypt the secured data according to the authenticationprocess.
 16. A system, comprising: an intermediate memory chip; a firstmemory chip; and a second memory chip, and wherein the intermediatememory chip comprises: a first set of pins configured to allow theintermediate memory chip to be coupled to the first memory chip viafirst wiring; a second set of pins configured to allow the intermediatememory chip to be coupled to the second memory chip via second wiringthat is separate from the first wiring; and a data mover configured tofacilitate access to the second memory chip, via the second set of pins,to read data from the second memory chip and write data to the secondmemory chip.
 17. The system of claim 16, wherein the intermediate memorychip is a non-volatile random-access memory (NVRAM) chip, and whereinthe NVRAM chip comprises a plurality of NVRAM cells.
 18. The system ofclaim 17, wherein the second memory chip is a flash memory chip, andwherein the flash memory chip comprises a plurality of flash memorycells.
 19. The system of claim 17, wherein the first memory chip is adynamic random-access memory (DRAM) chip, and wherein the DRAM chipcomprises a plurality of DRAM cells.
 20. A system, comprising: anintermediate memory chip; a second memory chip; and a processor chip,and wherein the intermediate memory chip comprises: a first set of pinsconfigured to allow the intermediate memory chip to be coupled to theprocessor chip via first wiring; a second set of pins configured toallow the intermediate memory chip to be coupled to the second memorychip via second wiring that is separate from the first wiring; and adata mover configured to facilitate access to the second memory chip,via the second set of pins and the second wiring, to read data from thesecond memory chip and write data to the second memory chip.